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Silicone thermal pad
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Silicone thermal pad
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Product introduction:
This series of products uses silica gel as the base material and combines other auxiliary materials through a special process. It is micro-adhesive, soft, and has high thermal conductivity. It is used for gap filling and shock absorption between electronic components.
Product Features:
| Product performance | Testing method | Unit | 5w | 6w | 8w |
| Basic performance | |||||
| Colour | Visual inspection | - | Color adjustable | Color adjustable | gray |
| Density | ASTM-D5470 | mm | 0.5~8 | 0.5~8 | 0.5~8 |
| Viscosity | ASTM D792 | g/cm3 | 2.2 | 2.8 | 3.2 |
| Hardness-Shore | ASTM D792-13 | Shore C | 18 | 25 | 32 |
| Operating temperature range | - | ℃ | -50~200℃ | -50~200℃ | -50~200℃ |
| UL fire rating | UL94-V0 | - | 94-V0 | 94-V0 | 94-V0 |
| Thermal performance | |||||
| Thermal conductivity | ASTM D5470 | W/mK | 5 | 6.1 | 7.9 |
| Thermal resistance @40mil,20psi | ASTM D792 | ℃-in2/W | 0.311 | 0.194 | 0.244 |
| Electrical properties | |||||
| Dielectric breakdown voltage | ASTM D150 | KV/mm | >3 | >3 | >3 |
| Volume resistance | ASTM D257 | Ω.cm | >1013 | >1013 | >1013 |
Applications:
● Semiconductor heat sink
● Communication equipment
● Graphics card
● Memory storage module
● Lighting equipment
● Desktop computer, notebook computer, network server D
● Power Supply
● LCD and plasma TV
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